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Encyclopedia of thermal packaging / editor-in-chief, Avram Bar-Cohen, University of Maryland, USA Set Thermal packaging tools

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    TK7870.15
    .E53 2015
     
    977618 (Reference),v. 4,BOK
    Encyclopedia of thermal packaging. - New Jersey , 2015.

         4 v. : ill. ; 26 cm.
         "A guide to cooling of electronic equipment.".
         v. 1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research / editors, Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia -- v. 2. Energy optimization and thermal management of data centers / Bahgat Sammakia, Yogend -- v. 3. Compact thermal models of electronic components / Clements Lasance, Mohammed- Nabil Sabry -- v.4. Thermally-informed deesign of microelectronic components / Ankur Srivastava, Sachin Sapatnekar, Bing Shi, Yufu Zhang.

         ISBN 9789814327602 (set)
         .-ISBN 9789814327633 (v. 1)
         .-ISBN 9789814327657 (v. 2)
         .-ISBN 9789814313841 (v. 3)
         .-ISBN 9789814583435 (v. 4).
         
         1. Microelectronic packaging 2. Insulation (Heat) 3. Electronic apparatus and appliances - Cooling.I. Bar-Cohen, Avram - 1946- II. Iyengar, Madhusudan III. Geisler, Karl J. L. IV. Sammakia, Bahgat - 1952- V. Lasance, Clements VI. Mohammed-Nabil, Sabry VII. Srivastava, Ankur VIII. Sapatnekar, Sachin IX. Shi, Bing - 1952- X. Zhang, Yufu - 1946- XI. Title
         Library : UiTM Shah Alam
    Accn No.Item StatusAdd IdLocationSMDItem Category
    977618Referencev. 4PERPUSTAKAAN TUN ABDUL RAZAK(P1)BOOKruj
    977619Referencev. 3PERPUSTAKAAN TUN ABDUL RAZAK(P1)BOOKruj
    977620Referencev. 2PERPUSTAKAAN TUN ABDUL RAZAK(P1)BOOKruj
    977621Referencev. 1PERPUSTAKAAN TUN ABDUL RAZAK(P1)BOOKruj

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