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Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu and Yong Liu

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  • MARC

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    TK7870.15
    .L58 2011
     
    933193 (Shelf),BOK
    Liu S.

         Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing. - Beijing , 2011.

         xxii, 564 p. : ill. ; 26 cm.

         ISBN 9780470827802 (hbk.)
         .-ISBN 0470827807 (hbk.).
         
         1. Microelectronic packaging - Simulation methods.I. Liu, Yong,1962- II. Title
         Library : UiTM Shah Alam; UITM Terengganu
    Accn No.Item StatusAdd IdLocationSMDItem Category
    933193ShelfPERPUSTAKAAN KEJURUTERAAN TAR(P3)BOOKRAK TERBUKA (OPEN SHELVES)

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