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Three-dimensional integration and modeling : a revolution in RF and wireless packaging / Jong-Hoon Lee, Manos M. Tentzeris

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  • MARC

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    TK7874
    .T435 2008
     
    877153 (Shelf),BOK
    Three-dimensional integration and modeling : a revolution in RF and wireless packaging. - San Rafael , 2008.

         vi, 108 p. : ill. ; 24 cm Synthesis lectures on computational electromagnetics v.17.

         ISBN 9781598294736 (hbk.)
         .-ISBN 1598294733 (hbk.)
         .-ISBN 9781598292442 (pbk.)
         .-ISBN 1598292447 (pbk.).
         
         1. Microelectronic packaging 2. Millimeter wave communication systems 3. Wireless communication systems.I. Title II. Series
         Library : UiTM Shah Alam
    Accn No.Item StatusAdd IdLocationSMDItem Category
    877153ShelfPERPUSTAKAAN KEJURUTERAAN TAR(P3)BOOKRAK TERBUKA (OPEN SHELVES)
    893503ShelfPERPUSTAKAAN KEJURUTERAAN TAR(P3)BOOKRAK TERBUKA (OPEN SHELVES)

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