Flip chip technologies / John H. Lau , editor
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| | | | | Flip chip technologies. - New York , 1996. |
| | xxiv, 565 p. : ill. ; 23 cm Electronic packaging and interconection series. | | ISBN 0070366098. | | | | 1. Microelectronic packaging 2. Multichip modules (Microelectronics) - Design and construction.I. Lau, John H II. Title III. Series | | | Library : UiTM Shah Alam |
| | Accn No. | Item Status | Add Id | Location | SMD | Item Category | | 388883 | Withdrawn | | PERPUSTAKAAN KEJURUTERAAN TAR(P3) | BOOK | RAK TERBUKA (OPEN SHELVES) | | 389489 | Shelf | | PTAR KAMPUS PUNCAK ALAM(PPA) | BOOK | ret | | 393202 | Shelf | | PERPUSTAKAAN KEJURUTERAAN TAR(P3) | BOOK | ret | | 426980 | Withdrawn | | PERPUSTAKAAN KEJURUTERAAN TAR(P3) | BOOK | RAK TERBUKA (OPEN SHELVES) |
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